Technology

Designed, Engineered,
and Manufactured Here.

GT Optics designs its own nanostructures, builds them through lithography, and completes each product through sputter-deposited engineered material stacks — configuring geometry, materials, substrate, and application process to the threat, environment, and duty cycle of each deployment.

Design

Nanostructures Simulated Before They Are Built.

Every GT Optics nanostructure begins in COMSOL Multiphysics — simulated in size, shape, and angular geometry against the electromagnetic threat spectrum, environmental profile, and application constraints of its intended deployment. The design step is where performance, weight, and manufacturability are engineered in from the start.

Geometry

Size, Shape & Angle

Each nanostructure is designed with specific size, shape, and angular geometry to interact with the electromagnetic threat profile of its target application.

Simulation

COMSOL Multiphysics

Nanostructure and material-stack designs are simulated in COMSOL before production, allowing performance and manufacturability to be engineered together.

Family

Multiple Structure Types

GT Optics designs a family of nanostructure architectures — including micro-optics, micro-mirrors, micro-magnifiers, and absorbants — matched to each product's shielding envelope.

Material Stack

Engineered Material Layers, Configured Per Application.

GT Optics products use a multi-material tech stack — engineered layers that can include metallic, magnetic, dielectric, conductive, and insulating materials — configured for the electromagnetic performance, environmental durability, and weight envelope of each product configuration.

Metallic

Conductive Layers

Metallic and conductive layers engineered to interact with the electromagnetic field profile of the target threat spectrum.

Magnetic

Magnetic Layers

Magnetic materials configured to extend performance into low-frequency and magnetic-field-dominated environments.

Dielectric

Dielectric & Insulating

Dielectric and insulating layers used to isolate, tune, and stabilize the electromagnetic behavior of the stack.

Manufacturing Process

Lithography Then Sputter Deposition.

Nanostructure geometry is transferred to substrate via lithography. Engineered material layers are then deposited onto the nanostructures and substrate through sputter coating. The result is a lightweight, conformable shielding film configured for its deployment class.

Step 1

Lithographic Transfer

Nanostructure geometry designed in COMSOL is transferred to the substrate through lithography — establishing the precise physical architecture that drives the film's electromagnetic behavior.

Step 2

Sputter Deposition

Engineered material layers are then deposited onto the nanostructures and substrate through sputter coating, completing the shielding architecture and locking in the product's shielding envelope.

Application Environments

Substrates and Application Processes to Match the Environment.

A single design and manufacturing platform is not one film with a single application method. GT Optics matches substrate selection and application process to the environment, motion profile, and duty cycle of each deployment.

Air

Aerial Environments

Configurations engineered for aircraft, unmanned systems, and airborne mission profiles.

Water

Marine Environments

Configurations engineered for maritime, USV, and corrosive-environment service life.

Heat & Cold

Temperature Extremes

Configurations engineered for the temperature envelope of the target deployment — data-center thermals, arctic operations, high-temperature industrial environments.

Motion

Static & High-Motion

Configurations engineered for fixed installations as well as fast-moving platforms.

Facility

Fixed Facilities

Retrofit and new-construction application methods for data centers, SCIFs, and critical facilities.

Component

Board & Enclosure

Component-level application methods for boards, enclosures, cabinets, cabling, and networking equipment.

Independent Validation

Tested by an Accredited Third-Party Laboratory.

GT Optics does not self-validate. Every performance claim traces to an accredited third-party report.

40–100+
dB Attenuation
Configured per program
100+
dB Across
30 MHz – 1.3 GHz
40 – 100+
dB Customizable
Range
ASTM
D4935-10
Test Standard
Laboratory
Accredited Third-Party EMC Laboratory
Test Standard
ASTM D4935-10 · Shielding Effectiveness of Planar Materials
Report
2511-235E Rev. A · January 2026
Frequency Range
30 MHz – 1.3 GHz Coverage
Intellectual Property

Patent-Backed and Field-of-Use Protected.

GT Optics' IP position is layered: exclusive field-of-use rights on the underlying patented technology, plus GT Optics' own provisional patent on the shielding film and coatings that makes the product portfolio possible.

Layer 1

Underlying Patented Technology

Exclusive worldwide license in the defense and DoD-contractor field-of-use to a 65+ patent portfolio in micro-optics and electromagnetic-spectrum manipulation.

Layer 2

GT Optics Own Provisional

GT Optics' own provisional patent on Micro-Facet Lightweight EMI Shielding Film and Coatings, filed February 18, 2025 — protecting the specific shielding-film architecture behind the product portfolio.

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Talk to the GT Optics team about test data, materials specifications, and program-integration requirements.